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Electroninks and SIIX expand additive EMI shielding partnership

Jul. 27, 2026
By AI, Created 13:33 UTC, Jul 27, 2026, AGP -

Electroninks and SIIX Corporation have broadened a strategic collaboration to develop additive EMI shielding for electronics in Japan and other markets. The move gives customers access to prototype spray-coating trials in a specialized ultrasonic environment, with automotive electronics among the target uses.

Why it matters: - Electronics are getting denser and running at higher frequencies, which is making EMI shielding a broader system-level design issue. - The collaboration aims to make conformal shielding easier to adopt by reducing weight, simplifying integration and increasing design flexibility. - The work could affect automotive electronics, power electronics and other assemblies that need lightweight shielding alternatives.

What happened: - Electroninks announced an expanded strategic collaboration with SIIX Corporation on additive high-frequency electromagnetic interference shielding. - The collaboration covers Japan and global markets. - SIIX introduced spray coating equipment and prepared a specialized ultrasonic spray coating environment. - The setup is intended to support prototype coating trials across a wide range of products.

The details: - Electroninks is providing its metal-organic decomposition conductive ink platform and spray coating process knowledge. - SIIX is contributing large-scale electronics manufacturing services infrastructure and global manufacturing reach. - The partners plan to help customers establish and evaluate additive EMI shielding approaches for a broad range of electronics. - Automotive is one of several potential target applications. - SIIX will serve as a distribution and collaboration partner for Electroninks’ EMI shielding materials and processes within Japan. - The companies said they will begin with prototype coating trials rather than immediate volume production. - Electroninks said the platform enables conductive coatings to be deposited directly onto complex geometries using precision spray coating. - The company said the approach creates lightweight alternatives to traditional metal shielding enclosures used in ECUs, Power Control Units and other electronic assemblies. - Electroninks said it provides materials and process knowledge and works with SIIX and customers to jointly define the printing and coating approach for each product. - Process parameters for specific MOD products and customer materials, including automotive plastics such as PBT, are established together during each engagement. - The companies have also created a framework to bring newly developed Electroninks materials into future coating trials. - Electroninks said it has installed advanced spray and printing systems internally to improve process consistency and support future scale-up. - The company’s conductive ink portfolio includes silver, gold, platinum, nickel and copper. - Electroninks said its inks are used in PCB manufacturing, semiconductor packaging, consumer electronics, wearables and medical devices. - Electroninks’ website is More information.

Between the lines: - The collaboration signals a move from materials supply toward joint process development, which can lower adoption barriers for manufacturers that need application-specific tuning. - Starting with prototype trials suggests both companies are positioning the offering as a co-development workflow rather than an off-the-shelf production line. - The emphasis on extending the framework to new materials and settings points to a platform strategy that could broaden use beyond the first set of customer engagements.

What's next: - The companies expect the collaboration to expand into additional applications, manufacturing regions and conductive material workflows. - Future work is expected to support broader electronics and semiconductor packaging markets. - SIIX and Electroninks will continue working with customers to define coating processes for new products as additional materials are introduced.

Disclaimer: This article was produced by AGP Wire with the assistance of artificial intelligence based on original source content and has been refined to improve clarity, structure, and readability. This content is provided on an “as is” basis. While care has been taken in its preparation, it may contain inaccuracies or omissions, and readers should consult the original source and independently verify key information where appropriate. This content is for informational purposes only and does not constitute legal, financial, investment, or other professional advice.

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